Electronics Forum | Mon Apr 04 18:23:35 EDT 2005 | GS
Solder volumes is very important parameter to keep under control in order to get a good and reliable CCGA solder joint, and an automatic 3D paste volume inspection is strongly recommended practice to use. Questions: - what Column pitch do your CCGA h
Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
Electronics Forum | Tue Dec 13 22:44:35 EST 2005 | Mike Kennedy
Russ, After a bit more research, I have found that the FLASH gold process doesnt use Phophrous in the process so should not have the black pad problems of ENIG. I am now surprised that you had problems. What did you experience? Was it an oxsidisation
Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui
Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your
Electronics Forum | Thu Apr 20 17:51:14 EDT 2006 | Don
Immersion tin, if it is being correctly identified, is not a final surface finish for a bare board. White tin is typically the way a finish is refered to. Either way tin has gotten a very bad reputation via a couple satellite failures because of tin
Electronics Forum | Fri Jun 09 08:20:56 EDT 2006 | kehoem@bellsouth.net
We have a board calling out for 50 micro-inches of nickel over 30 micro-inches of gold. This is a solid gold board on Rogers material. ENIG cannot be deposited that thick right? Electroplated gold (we thought) was usually 35-50 micro-inches and was
Electronics Forum | Wed Jun 14 11:32:44 EDT 2006 | muse95
There is an IPC test method involving a tape test, which you can try for a start. Look at the IPC TM-650 free on the IPC site. Black pad occurrences are much reduced, but I don't believe you can say they never happen, even to the better board houses
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Fri Jun 16 10:23:40 EDT 2006 | pms
Thanks Davef, We recommend ENIG to our customers at this time, we have not had any customers reporting issues with it so far. I like the protection of the nickle from copper dissolution during wave in a PB free scenerio, but the "Black-Pad" issue i
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
