Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Wed Mar 16 20:11:03 EST 2005 | darby
KT, What sort of delta T are you getting? This does sound a bit odd. TCs are in EXACTLY the same position on each board? Something I only recently found out - according to Mark Cannon from ERSA re profiling, that you may wish to consider. 1.TCs sho
Electronics Forum | Thu Mar 24 07:06:06 EST 2005 | davef
There's a lot of comparison tables on the web. Here's one: Properties - Summary [A Winlow Circatex] Attribute||Hasl||Immersion Silver||Immersion Tin||Electroless Pd||OSP||Eless Ni / Imm Au Shelf Life (months)||12||12||12||12||12||6 Multiple Reflows
Electronics Forum | Tue Apr 05 08:41:39 EDT 2005 | aj
Guys, I posted a thread on this sublect a while back and I thought we had it sorted but we have the same issue again. One of the SMT operators has chapped skin,sores which sometimes cause cuts. This looks extremely uncomfortable. We thought it was
Electronics Forum | Wed May 18 04:17:05 EDT 2005 | kvanzill
Hello All, I recently accepted a position in a manufacturer in Mauritius and they have begun a little more then a year ago COB process which I am unfamiliar with and needing some help. We are using aluminum wire, the machine is Dias Automation model
Electronics Forum | Fri May 20 02:04:26 EDT 2005 | kvanzill
Hello, I have been having random yeild problems with my COB process where we have non-sticking issues and no parameters have been changed on the machine from one assembly to the next. I recently inquired to the board manufacturer's about thier proce
Electronics Forum | Tue Dec 13 22:58:43 EST 2005 | Mike Kennedy
Dave, I have read an article by Vern Solberg who said that Electro plating Ni/Au in not recommended for PCB's. I have tried his email but get bounce back. Do you know him or his email? I knows its a long shot to ask you, but it never hurts to ask...
Electronics Forum | Tue Mar 14 13:42:45 EST 2006 | patrickbruneel
If the OSP boards have gone through double reflow I assume that you use an aggressive (halide) flux for wave soldering. SAC 305 is known (search the archives) to dissolve copper faster than other lead-free alloys. This together with an aggressive flu
Electronics Forum | Tue May 02 07:46:39 EDT 2006 | Bob R.
Be careful about taking any generic advice and trying to use it to reduce voiding for your particular paste with your particular boards. I've done a few literature searches over the years on causes/cures for BGA voiding in the SnPb world and found a
Electronics Forum | Fri Jun 09 11:18:25 EDT 2006 | kehoem@bellsouth.net
Question; Do you think it's possible that your customer has got his units mixed up & actually means 0.3 micro inches of gold over 0.5 micro inches of Nickel? That is what I said but their vendor says they are building to print which says 80 uM and i
