Electronics Forum | Fri May 17 05:12:51 EDT 2013 | ultimatejoker
What is the disadvantage of palladium plating instead of gold plating? I saw many advantage of palladium plating in term of hardness, wear resistance, and price but why most of the PCB Industries still use gold in PCB pad? Thank you
Electronics Forum | Tue Mar 01 10:31:26 EST 2005 | Greg
QC --> Touch-up --> QC --> Assembly After SMT all PWB goes to QC, QC Inspects and marks all that needs rework then PWB's goes to Touch-up to fix what QC marked for rework. After that All reworked boards goes to QC for another verification and stampi
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef
Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.
Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef
First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu
Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch
Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun