Electronics Forum: entek and life (Page 1 of 9)

OSP PCB Shelf life and part packs

Electronics Forum | Thu Sep 27 16:40:12 EDT 2012 | davef

Ideally, shelf life should be twelve months from application, but not all OSP's are the same so check manufacturer's instructions

OSP PCB Shelf life and part packs

Electronics Forum | Thu Sep 27 09:53:46 EDT 2012 | testbloke

Anyone ?

OSP PCB Shelf life and part packs

Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke

Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow

Siemens HS50 and F5 and S25

Electronics Forum | Mon Nov 27 16:31:07 EST 2000 | Chris Jackson

I am evaluating several pieces of Siemens equipment and would like to get some input from industry users. I am seeing that Siemens is able to meet cycle time estimates and thus throughput. I am concerned about the robustness?? Any input is welcome. T

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

GSM2 and FlexJet heads

Electronics Forum | Sat Oct 10 16:05:27 EDT 2009 | dilogic

I would if someone can share his "real-life" experience with FlexJet (7-spindle) heads. We are currently running machines with Flex heads (4-spindle), which are very easy to maintain, but I suppose 7-spindle has more throughput. All comments are welc

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? I

AXI and AOI

Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

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