Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Electronics Forum | Thu Oct 01 07:09:53 EDT 2009 | g2garyg2
Good Morning Here are a few thoughts. When mfg large flex circuits you will need to fixture them to create a stable production environment. As such, the foot print fo the product grows. So you may require systems that can handle 20 inch width by 38 i
Electronics Forum | Fri Feb 19 12:58:33 EST 2010 | patrickbruneel
Loco, If after reading these articles you still don’t believe Toyota went lead free let me know. Toyota developed their own lead free alloy http://sciencelinks.jp/j-east/article/200016/000020001600A0589899.php Quote” Several engineers are readyin
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
Electronics Forum | Fri Apr 16 12:47:48 EDT 2010 | boardhouse
White solder mask does have a tendency to yellow within the lead free environment. so double coating will not help any. I due believe the flux is a factor in the yellowing but due to the color is the main reason. Find out what brand of S/M mask they
Electronics Forum | Wed May 12 13:34:02 EDT 2010 | hegemon
Thanks Pete B - great info. I am currently preparing a DOE to address concerns about reflow of componentry on the bottomside of the PCB while in the vapor. Specifically cosmetics and part dropping. Bottom side has no flux, but will be fully reflow
Electronics Forum | Thu Oct 14 09:33:10 EDT 2010 | sachinnalbalwar
Hi All, Is there any way to use ROHS6/6 [Non-leaded] BGA device in Non-ROHS reflow [240 Deg C] temp. environment. I need to do this because Leaded [ROHS5/6] device I was using is obsolete and Non-leaded[ROHS6/6] drop-in-replacement part is availab
Electronics Forum | Thu Sep 15 19:12:27 EDT 2011 | smtmaxmary
WELCOME TO SMTmax Established in 2009, the Omxie Corp. is headquartered in California, with several offices worldwide. Our primary focus is in the development, manufacturing and marketing of SMT tools and equipment for prototyping and production. Ou
Electronics Forum | Fri Nov 25 14:52:50 EST 2011 | davef
Sn43/Pb43/Bi14 is a low temperature leaded alloy that has been used with very good success. The low melting point helps avoid some thermal shock issues on some assemblies. A word of caution, this alloy forms a low melting point at approximately 95*C.
Electronics Forum | Tue Dec 13 17:41:04 EST 2011 | davef
A Study Of 0201’s And Tombstoning In Lead-Free Systems, Phase II Comparison Of Final Finishes And Solder Paste Formulations http://sheaengineering.com/Documents/APEX%2008%200201s%20and%20Tombstoning%20phase%202%20paper.pdf CONCLUSION The condition
