Electronics Forum: epoxy and void (Page 1 of 14)

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

What is the solution for removing epoxy on BGA chips?

Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef

Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 17:47:05 EDT 2006 | davef

First, we expect voiding in imm silver to be similar to ENIG. We expect more voiding in OSP than other common solderability protection. Second, choosing a solder paste, which does not contain resins and activators that decompose at higher temperatu

N2 and Voiding??

Electronics Forum | Wed Oct 17 09:55:48 EDT 2012 | anvil1021

Has anyone ever experienced void increase while using N2? Thanks for the Help!! anvil

Voids and BGA

Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha

Imm Silver and Voiding

Electronics Forum | Thu Jun 22 00:16:24 EDT 2006 | Gman

Hello, Has anyone had issues with voiding while using Imm Silver PCB finish. Does thickness of silver, contamination of the plating bath or other factors if you come point out cause voids due to the plating.

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

Silver Epoxy and CEM3

Electronics Forum | Wed Aug 26 12:02:23 EDT 1998 | Steve Joy

Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? What are the limitations? Thanks, Steve

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

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