Electronics Forum: epoxy remover (Page 1 of 12)

BGA epoxy removal

Electronics Forum | Thu Feb 26 04:56:35 EST 2015 | slave2anubis

anyone?

BGA epoxy removal

Electronics Forum | Thu Feb 26 10:33:01 EST 2015 | emeto

Take a look at articles that explain underfill process and how to remove/rework underfill: http://www.finetechusa.com/rework/applications/underfill-rework.html http://www.circuitnet.com/experts/86535.shtml

BGA epoxy removal

Electronics Forum | Thu Feb 26 13:29:36 EST 2015 | swiese242

Use the appropriate heat for that part. You can then use techspray flux remover with a brush. Spray the brush, and not the board, to reduce spreading the flux. Acetone or alcohol are less expensive and may work as well.

BGA epoxy removal

Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef

Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w

BGA epoxy removal

Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis

Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t

BGA epoxy removal

Electronics Forum | Sun Feb 22 15:46:09 EST 2015 | slave2anubis

Hi, my name is Dacian, and i run a mobile phone repair shop in Timisoara, Romania. Lately we decided to do more advance motherboard repair jobs, and a big problem that we have is, cleaning the board after we remove the chips. We repair manly iPhone,

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

| I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ

I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ

What is the solution for removing epoxy on BGA chips?

Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma

What is the solution for removing epoxy on BGA ics?

  1 2 3 4 5 6 7 8 9 10 Next

epoxy remover searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

High Throughput Reflow Oven
Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers
Best SMT Reflow Oven

World's Best Reflow Oven Customizable for Unique Applications
SMT spare parts

500+ original new CF081CR CN081CR FEEDER in stock