Electronics Forum: epoxy void (Page 1 of 4)

Re: reliability of epoxy

Electronics Forum | Thu Aug 06 12:49:41 EDT 1998 | justin medernach

I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and the

Re: reliability of epoxy

Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here

I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t

What is the solution for removing epoxy on BGA chips?

Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef

Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown

SMD Adhesive Testing

Electronics Forum | Wed Dec 11 20:40:25 EST 2002 | davef

Se�or Tech Consider the following in evaluating your adhesive: * Determine the ability to dispense/print epoxy dots over the full range of application diameters/volumes. * Assess the ability to dispense/print epoxy without undesirable characteristic

Voids in transfer mold process

Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann

Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if

Circuit Card Assembly Molding

Electronics Forum | Fri Apr 01 17:45:31 EDT 2011 | smt_guy

thanks for all your replies. we tried running our beta runs and have lots of issues. first our molding process which was set to 450'F temp at 1200 PSI smashed the circuit card components and penetrated the epoxy compound we used to encapsulate the C

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob

Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi

Re: High Tg laminates

Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F

John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th

Black Ink / Black Top for Epoxy Bodied Components

Electronics Forum | Mon Dec 21 14:38:11 EST 2009 | bandjwet

Does anyone know of a vendor of "black top" to fill in voids left by laser "X-out" patterns in the top of an epoxy (plastic) package ? We are demarking an area of a device and would like to fill it in with something other than a colored epoxy. Reg

via under a smd pad ?

Electronics Forum | Fri Nov 23 16:32:05 EST 2007 | davef

There a several things you can do to prevent the solder wicking down the hole with the current design, and that's where you should focus. Cost goes up as you go down the list, but in neither case do you need to respin the board, have solder starvatio

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