Electronics Forum: ersa and 300 (Page 1 of 5)

Pick and placement forces

Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station

This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul

High-end SPI and AOI?

Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany

Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >

PDBE and PBB replacements???

Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef

RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet

Inspection and splicing

Electronics Forum | Thu Dec 21 13:11:25 EST 2006 | SWAG

We have fought with cut-tape way too much. It's always a bad idea. We've tried a couple methods/devices for manual splice with limited success. Before you look into this I would ask them if they could supply you cut tape qty's inslusive of fairly

board stretch and IPC -D-300G

Electronics Forum | Tue Nov 13 09:25:42 EST 2001 | davef

Maybe. While it doesn't help with your current problem, there is nothing that says that you cannot impose requirements in your purchase order that are stricter than D-300.

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

BGA ball and PCB pad

Electronics Forum | Wed Feb 18 12:42:43 EST 2004 | babe

OK, if the sphere of the ball and the paste on the pad are both eutectic, 63/37 then the paste will reflow first causing a drop of the component, after which the spheres will reflow causing a double drop and a good intermettalic. You can see this by

Rework and repair system suggestions

Electronics Forum | Thu Jan 27 11:33:59 EST 2005 | russ

For what you have right now I would recommend that you use soldering iron tips that are made for component removal. until you get BGAs I wouldn't worry a whole lot about the expensive rework equipment. I would use specialty tips and a heat gun wit

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 04:41:58 EDT 2006 | Rob

MF300S is quite an old flux, & a lot has happened since then on the flow solder front - are you sure it's designed for Lead free, or is it just a traditional flux that SHOULD work OK with Lead free?

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 13:04:35 EST 2001 | slthomas

We've got a problem with a fine pitch board that has about .005" registration error at each end (towards the center of the board) when it's printed. Apparently we've got a case of board stretch generated at the fab shop. I still have to do some mea

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