Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang
| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther
Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson
| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi
Electronics Forum | Mon Nov 12 15:21:09 EST 2012 | davef
High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components. What are your:
Electronics Forum | Fri Oct 08 10:08:48 EDT 1999 | Glenn Robertson
| | | | I have a board, 4 spacers needed to be soldered on the board | | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first,
Electronics Forum | Thu Nov 08 10:52:22 EST 2012 | Bryan Ng
I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro c
Electronics Forum | Mon May 17 02:10:16 EDT 2004 | johnwnz
Straw pole time folks, how many have or are doing wave soldering of Lead free products and are you using N2 in the process, what level of solids are you using and are you cleaning? I've heard a story that soem people in Japan are running a high sol
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Mon May 17 20:39:49 EDT 2004 | Ken
I disagree about the maintenance issues with tin/copper solder. All high tin content solders are hard on machines (silver or not). More dross? Controlling the back flow, front flow velocity and AVOID constant surface cleaning will reduce your dros
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Tue Sep 13 02:51:35 EDT 2022 | sarason
Lead and tin form a eutectic solution. So no to that one, as to breaking some rule or other other people who are far more knowledgeable than me on "the rules" could pipe in. Also tin/lead eutectics don't grow tin whiskers like a lot of the replacemen
