Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007
3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?
Electronics Forum | Thu Aug 08 19:20:08 EDT 2013 | hegemon
I too am hoping a NADCAP guy might jump in here. I would like to know how this portion of the question is handled. Evidence of PM, periodic cleaning of EQ and tools, no issues. Thermocouple calibration? You would think that evidence of Oven CAL
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill