Electronics Forum: evident (Page 1 of 34)

Standard for BGA void

Electronics Forum | Mon Oct 21 08:46:15 EDT 2002 | davef

60% 36% of ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept Reject 30% of ball diameter >30% 09% of ball area >09% II. Missing Ball: This is prohi

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

OT: Wavesolder Process Engineer Needed

Electronics Forum | Mon Jul 21 07:29:00 EDT 2008 | realchunks

Have any of you ever tried this with a glass plate? I see a lot of white papers, but no actual evidence. Now that we can post pix, I'd think someone would do post their evidence.

Underfill Inspection Criteria

Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis

Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The

Solder Fillet

Electronics Forum | Tue Jul 01 22:20:26 EDT 2008 | davef

Fillet Height [F]. Wetting is evident on the vertical surface of the termination as the minimum fillet height.

Temperature Profiling

Electronics Forum | Tue Dec 29 11:39:50 EST 2009 | kpm135

Why don't you post the link to the article so we can all read the evidence of this.

Solder briding on QFP

Electronics Forum | Sat Feb 27 02:19:21 EST 2010 | dcell_1t

any evidence of dendritic growth?? (cause of the presence of condensed water due to high humidity level)

Heel bend wetting for Gull Wing lead

Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007

3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?

NADCAP and thermocouple calibration

Electronics Forum | Thu Aug 08 19:20:08 EDT 2013 | hegemon

I too am hoping a NADCAP guy might jump in here. I would like to know how this portion of the question is handled. Evidence of PM, periodic cleaning of EQ and tools, no issues. Thermocouple calibration? You would think that evidence of Oven CAL

SMD Gull Wing Switch Cracking

Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow

Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill

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