Electronics Forum | Tue Dec 19 08:32:44 EST 2006 | davef
Take your choice: * Can't image this is a good thing. The board under the die will 'dry-out' and turn brittle over-time. It's possible the way attachment glue bonds to the board will change as the board dries-out. * Epoxy suppliers pad their number
Electronics Forum | Tue Dec 19 07:58:29 EST 2006 | ccgooi
Our company is assembly flip chip on flex, we have new design of flip chip which die temperature will increase until 145 degree C after test run the end product, however the Tg,glass transition temperature is 148. Will this case causing any reliabil
Electronics Forum | Wed Dec 20 10:04:07 EST 2017 | junkeymonkey246
Hello there, I work at Redcom Laboratories in Victor NY. I'm a student and new to being a machine repair technician. I'm having some bother with one of our TYCO QUAD QSP-2 machines. I keep getting the errors: "WARNING: Head#2 Nozzle RUNOUT=27.1 mi
Electronics Forum | Wed Nov 10 18:55:04 EST 2004 | Dreamsniper
J-STD-001 8.4.1 Chlorine content should not exceed the following:
Electronics Forum | Thu Nov 11 09:16:48 EST 2004 | Dreamsniper
J-STD-001 8.4.1 Chlorine content should not exceed the following:
Electronics Forum | Mon Aug 08 08:08:10 EDT 2005 | davef
Could the temperature of your reflow recipe be exceeding the limits of the materials used to fabricate your board?
Electronics Forum | Mon Aug 22 07:10:44 EDT 2005 | davef
We see this after exceeding the maximum temperature of the component.
Electronics Forum | Sat Feb 18 17:02:30 EST 2006 | GS
72h " and " Exceeding Floor Life =
Electronics Forum | Wed Dec 20 11:04:01 EST 2017 | junkeymonkey246
Perfect! Thank you bobpan! Shes up and running again.
Electronics Forum | Thu Sep 21 17:50:43 EDT 2000 | Bill Boles
Does anyone have a quick reminder for a PCB with immersion gold surface finnish going through a reflow profile: Which of the following statements is more correct? A: In order to minimize gold in the intermetallics of the solder joint, the board temp
