Electronics Forum: excess (Page 26 of 85)

Re: Microcracking in SMT Pick&Place process

Electronics Forum | Thu Jun 25 09:37:48 EDT 1998 | Russ Miculich

The real causes of microcracking are not normally due to pick and place - particularly if you are using a piece of equipment with vacuum pick up and release. The real cause of microcracking is due to thermal stresses on the die and the choice of the

Re: Hot Air Knife

Electronics Forum | Thu Mar 09 04:02:12 EST 2000 | Wolfgang Busko

We used an air knife using foam fluxer and no clean flux to remove excessive flux from the boards for a better look afterwards. A secondary effect might be that the flux is forced into the vias giving you better results on the top. If you feel a need

Re: Cure/Reflow Profile

Electronics Forum | Tue Feb 22 11:53:16 EST 2000 | JAX

Sal, To answer your first statement; Yes, you can cure paste and reflow solder using one profile. Question on your second statement; Are you talking about running passive side glue, flipping it over, running active side solder, and then putting the

Re: Chip on board - board metalization

Electronics Forum | Mon Jan 08 20:26:12 EST 2001 | Dave F

Ask your supplier if he will guarantee to cover rework, warranty, and lost business costs, if he's incorrect. Below 2uinch gold is very pourous and not worth anything in preventing corrosion of your nickel undercoat. 3 uinch has to be the absolute

Re: gold finish on pcbs

Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F

In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob

Re: PCB delamination

Electronics Forum | Mon Nov 06 21:02:30 EST 2000 | Dave F

I love this!!! Two whizzettes with the same information and they spin-off in two different directions. Gad this is great!!! Delamination is a pretty broad topic, but that you have a problem with two suppliers makes me think the delamination is cau

Wave Soldering SMT IC

Electronics Forum | Mon Oct 16 11:10:51 EDT 2000 | PeteC

Excessive bridging on SOICW-20, -16, SOIC-8, -14,-16. I've got a board, 4" x 6" w/ SOICs on bottom-side for wave solder. I've checked topside board temp for flux activation, wave height, wave surface with the glass check-plate going from 1" to 2" spa

Re: SMD TAPE SPLICING TOOL

Electronics Forum | Thu Jul 20 18:19:53 EDT 2000 | Darby

If you are using embossed tape you can use super glue and put the last pocket of the old tape into the first pocket of the new tape, or visa versa if that suits your feeders better. You can also simply glue old peelback onto new leader, wipe away all

Re: Measuring Board Deflection

Electronics Forum | Thu Jul 20 14:07:23 EDT 2000 | JohnW

Mike, we use carrier's as a matter of course on all wave products, it let's us keep the conveyor width the same all the time so speed's up change overs and eleimiates one more thing that can be set wrong. The main aim of the exercise is to be able

Re: Vectra Wave

Electronics Forum | Mon May 08 16:01:11 EDT 2000 | John

I was running the conveyor at 3.75 when we started the discussion with Electrovert. Unfortunately, foam fluxing is a fact of life for us. Our products have open contact relays that can become contaminated by spray fluxing. Titration is our only me


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