Electronics Forum | Tue Mar 23 03:42:51 EDT 2010 | grahamcooper22
Hi, It is very important to follow IPC JEDEC 33 specification for storage and handing of all MSDs. In many instances defects caused by excess moisture in packages is not immediately evident (pcbs may pass final test) but when pcb has been in the fiel
Electronics Forum | Fri Mar 26 17:12:43 EDT 2010 | spitkis2
Krish, Looks like your peak temperature is around 230C and time above 183C is about 120-150 seconds. This is excessive for a leaded BGA. You should be aiming at 200 - 215C as the peak joint temperature with time above 183C of 60 -90 seconds. The p
Electronics Forum | Mon May 03 11:20:43 EDT 2010 | mikesewell
A good guideline is keep it similar to your wave solder process, for example 2-3 sec. This assumes you're preheating the assembly. While polyimide boards are fairly robust at some point you will begin to see copper dissolution - the solder side pad
Electronics Forum | Tue Jun 01 08:42:08 EDT 2010 | rgduval
I'm randomly having some motor move errors, as well. If you swap your MOT board, and the problem continues, you're down to a couple of problems. Could be that the motor is getting ready to die on you. Could be an encoder problem. Or, could be som
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Tue Aug 03 17:45:43 EDT 2010 | swag
I used to wrench on those all the time! I really should be more help to you but it was a few years ago... A few more things to check - clean the line sensors on the back of the machine. Check to make sure you don't have a feeder that is allowing t
Electronics Forum | Wed Aug 18 09:41:47 EDT 2010 | namruht
Are you controlling humidity in your plant? I'm > not familiar with that particular paste, but some > pastes are sensitive to a humid environment. We > also had one paste supplier send us a batch that > had excessive solder balls if the boards
Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22
Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Wed Sep 19 12:27:56 EDT 2012 | proceng1
Are you sure that you are getting adequate nitrogen flow up through the cap? If your pump isn't seated properly, you may have nitrogen escaping. Also, I have two different height nitrogen bases. The shorter one does not allow as much gas to escape
