Electronics Forum: excess (Page 66 of 85)

Hidden Pillow Phenomenon

Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef

"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 14 18:38:59 EST 2006 | Brandon

Hello all, I am having an issue with some boards on our Wave Solder. It is a Pb free wave and These particular boards are exibiting A LOT of what I call solder bubbles in the larger than usual vias and un-used thru holes. Settings: 4 inch/min 144c to

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york

Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible

Yield on 0402 SMT Printed Circuit Board Assemblies

Electronics Forum | Mon Jan 08 03:47:47 EST 2007 | tk380514

as someone had said before, check you stencil and have it redesigned. I design our stencils for my factory and have inproved quality in BGA , QFP and 0603 case sizes. we did have 1 prototype series that used 0403 chips btu we had brand new feeders an

Solder paste handing

Electronics Forum | Mon Jan 15 06:18:50 EST 2007 | CL

Good Morning Stephen, 1) Most solder paste manufacturers recommend a 2 hour temperature stabilazation period. Solder paste should not be opened and exposed to ambient air if it is still cold. 2)Manufacturers do not reccomend mixing old and new paste

DPMO as a metic to qualify a CEM as World Class

Electronics Forum | Mon Jan 29 16:04:29 EST 2007 | BillW

Thanks Russ and John, To clarify defects when manufacturing a PCBA, I use (2) groups of defect categories, one for components and one for solder joints. These can be calculated separately or combined A component defect could be: Missing, Miss-alig

Lead manufacturing to lead free transisition

Electronics Forum | Thu Mar 01 21:20:47 EST 2007 | J.R.

Let's talk pin holes and blow holes. I've been here since the transistion of leaded to lead-free process started for our company and we purchased a wave machine just to keep up with our lead-free orders. we put out 500-1000 boards a day both leaded a

Solder wave

Electronics Forum | Mon May 07 16:00:38 EDT 2007 | patrickbruneel

Dave, There is not really a �smart� or scientific way to check this but I know of easy ways and very effective ways. Fex. an easy way to check is with a 3� spatula, you hold the spatula at the same angle as the board and drag trough the wave simula

AOI Inspection equipment for populated PCB's

Electronics Forum | Thu Dec 18 13:05:59 EST 2008 | tsvetan

we have omron, before buy I have evaluated lot of other machines, what I like most is the three ring at different angle lighting which allows pseudo 3-d solder joint evaluation and historgams with statistics, you can see out of total solder joints ho

Recommendations on Solder Scavenging Systems

Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef

Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s


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