Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Tue Mar 25 09:08:13 EST 2003 | davef
Rework and repair methods are: * 7721 - Repair & Modification of Printed Boards & Electronic Assemblies * 7711 - Rework of Electronic Assemblies There are no standards regarding: * Repair and rework of electronic assemblies. * Reclaiming component
Electronics Forum | Wed Apr 02 09:25:32 EST 2003 | davef
RDR The most common cause of dewetting is from a fabricator using any form of abrasive (e.g. pumice, abrasive brushes etc.) on copper. With this process, abrasive particles get implanted into the copper (often actually swaging copper over some of th
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Thu Jun 12 13:57:30 EDT 2003 | jgregory
Yes, I am a customer. I've bought brand new machines from this mfr. before. Many times, actually (through sales reps.). And when their tech support helps us troubleshoot a problem down to a component, we actually pay the three, four, five times the a
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Tue Jul 08 20:24:26 EDT 2003 | davef
AlCapone: Consider determining the responsible party according to their ability to deal with the complexity of collecting and analyzing the information required to determine your process capability index. For expample: * Reflow oven: Fairly simple,
Electronics Forum | Fri Sep 26 18:00:16 EDT 2003 | johnthor
Gee Steve, it's nice that someone remembers me. Yes Dave, I noticed that you did too. I feel guilty about having become a "lurker" when I manage to look in now and then but the pressures of what they expect me to do around here (for no more money!)t
Electronics Forum | Mon Nov 17 11:09:56 EST 2003 | Frank
Hi, I have a soldering problem with a header SMT straight single row of 8 pins. It's a samtec #TSM-108-03-T-SV-P (P&P). The first problem I have is an allignement one. I do not use alignement pin for now but I expect to use it. Concerning solder
