Electronics Forum: exploding and solder (Page 1 of 104)

exploding reflow paste

Electronics Forum | Thu Aug 19 08:22:05 EDT 2004 | Rafal M.

Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of problems with golden pads - it's dirty when going out

exploding reflow paste

Electronics Forum | Thu Aug 19 09:05:32 EDT 2004 | davef

We understand that you are getting solder on your gold fingers. If this is correct, search the SMTnet Archives, while you're waiting for others to respond. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=5127

WSOL and solder pot

Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator

I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman

Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.

WSOL and solder pot

Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator

The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

solder balls and flux

Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann

My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink

WSOL and solder pot

Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator

I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS

WSOL and solder pot

Electronics Forum | Thu Mar 13 09:43:13 EDT 2008 | jseagle

If the mask is not cured and is coming off in the pot I don't see how it is protecting anything. If you want to mask something fast you need to use tape not liquid mask that requires cure. My $.02.

  1 2 3 4 5 6 7 8 9 10 Next

exploding and solder searches for Companies, Equipment, Machines, Suppliers & Information

MSD Dry Cabinets

Benchtop Fluid Dispenser
Voidless Reflow Soldering

High Resolution Fast Speed Industrial Cameras.
PCB separator

Thermal Transfer Materials.