Electronics Forum | Tue Mar 04 17:47:19 EST 2003 | msivigny
Hello EW, thanks for your input, the data collection for measurements such as these can get confusing because you're calculating deviations from set point location to actual placement location and then analyzing the full result. Then there are many o
Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp
I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw
I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a
Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin
Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole
Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef
Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity
Electronics Forum | Wed Aug 19 08:00:55 EDT 1998 | Earl Moon
| Hi there, | I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In orde
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
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