Electronics Forum: expose (Page 1 of 59)

to seal exposed copper layers

Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG

Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara

We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is

Removing Green Masking on PCB's

Electronics Forum | Fri Jun 15 13:17:27 EDT 2001 | CPI

Are you exposing so you can solder and SMD component directly to it? If not are there ant vias near by that connect to the area you are trying to expose? If not I have done as Dave suggested using a dremal tool. Messy but it works.

BGA Moisture Absorption

Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza

Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Sun Sep 27 11:41:13 EDT 2009 | rajeshwara

We are using ST Demodulator QFP in our product which have exposed pad / heatsink from bottom side. Visually or in magnifier the solder joint or fillet looks good but if we touch up the pins with soldering guns , PCB works fine.

Fiber exposed on board edge

Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016

After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?

QFN Side fillet

Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon

some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Thu Oct 01 08:34:50 EDT 2009 | davef

First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond that, the temperature measured by thermocouples on your oven heaters are only loosely related the temperature of solder paste on your board. You need t

via masking

Electronics Forum | Thu Dec 13 20:54:23 EST 2001 | davef

There is neither �nominal thickness� nor �is there a set maximum� for via masking. We use some of our vias as test pads. So, as you�d expect, we get rabid when we get mask bleed onto these pads. IPC-6012 - Qualification & Performance For Rigid Pri

Reflow PBGA

Electronics Forum | Tue Jun 25 16:02:03 EDT 2002 | dason_c

Is the paste fresh or not or exposed to the floor for a longer time. What kind of the paste which you are using?

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