Electronics Forum | Sat May 22 19:38:59 EDT 1999 | Omat Marasigan
| Earl, | | your colourful impressive descrptions are a joy to read..well lighten's up my day but maybe it's just me...ummmm..? | | anyhoo, Omat, as Earl has said ..this is a moisture sensative problem basically the reason you blow the shit out of
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Tue Apr 20 17:56:42 EDT 1999 | Chrys Shea
| | I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following
Electronics Forum | Thu Jan 28 17:37:00 EST 1999 | Earl Moon
| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k
Electronics Forum | Thu Jan 28 17:37:02 EST 1999 | Earl Moon
| | | | | Greetings, | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | Also, is there any danger of the pcb's giving off some k
Electronics Forum | Fri Jan 29 07:55:52 EST 1999 | Wayne Bracy
| | | | | | Greetings, | | | | | | | | | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | | | | | Also, is there any danger of the pcb's giving of
Electronics Forum | Thu Jan 07 16:46:05 EST 1999 | Steve Gregory
Hey ya'll!! SUCCESS! I was able to get that monster off!...(Now I just gotta' be able to get it back on right...hehehe) If you remember, the whole reason I had to rework it was because somehow they got the hole positions wrong in the board for
Electronics Forum | Wed Jan 06 21:56:37 EST 1999 | Steve Gregory
| Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socket
Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon
| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder
