Electronics Forum | Fri Oct 20 14:13:32 EDT 2000 | DENNIS XIONG
Dear all, We have a PCB design mistake that causes exposed copper layers on the edges of breakaway locations. Although we fixed the design, but we already made a lot of boards plus many made before we found the problem. I wonder if any one have some
Electronics Forum | Tue Jan 12 11:14:37 EST 2016 | mfgengr2016
After the CCA is been de-paneled I find exposed board fibers. Should the board edge be sealed with an epoxy to keep moisture from getting into the CCA?
Electronics Forum | Thu Jan 14 09:25:34 EST 2016 | davef
IPC-A-610F 10.2.6 Laminate Conditions - Depanelization talks to the acceptability of the depanelization criteria for assembled boards. There is no requirement for moisture sealing with epoxy or other material. Basically, the standard requires that th
Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara
We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is
Electronics Forum | Fri Jun 15 13:17:27 EDT 2001 | CPI
Are you exposing so you can solder and SMD component directly to it? If not are there ant vias near by that connect to the area you are trying to expose? If not I have done as Dave suggested using a dremal tool. Messy but it works.
Electronics Forum | Wed Jun 18 07:26:42 EDT 2003 | rmurtuza
Do BGA packages absorb moisture to a great extent if kept exposed to an atmosphere of 300C and 60% relative humidity overnight? Should they be backed before reuse. How long can they be kept exposed without the requirement of baking. Are there any spe
Electronics Forum | Sun Sep 27 11:41:13 EDT 2009 | rajeshwara
We are using ST Demodulator QFP in our product which have exposed pad / heatsink from bottom side. Visually or in magnifier the solder joint or fillet looks good but if we touch up the pins with soldering guns , PCB works fine.
Electronics Forum | Mon Jul 22 02:13:31 EDT 2019 | jandon
some PQFN package configurations have no toe exposed or do not have a continous solderable surface on the exposed toe and a toe fillet will not form. (IPC-A-610F 8.3.13)
Electronics Forum | Thu Oct 01 08:34:50 EDT 2009 | davef
First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond that, the temperature measured by thermocouples on your oven heaters are only loosely related the temperature of solder paste on your board. You need t
