Electronics Forum: exposure (Page 16 of 29)

Re: Soldering die to heatsinks

Electronics Forum | Fri Apr 17 14:08:44 EDT 1998 | Earl Moon

Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys? Let me get this straight... He's

Re: Electronics Assembly Course

Electronics Forum | Thu Aug 19 11:19:41 EDT 1999 | Rich Cary

Is anyone aware of a good, basic Electronics assembly course? There is a manufacturing project leader in my company that needs to get some good exposure ... quickly. He is particularly interested in design for manufacturing. Mike, I just inve

Re: Component Baking

Electronics Forum | Fri May 22 11:12:25 EDT 1998 | Mike Glenn

Does anyone know about low pressure/low temperature ovens used for baking of moisture senstive components? Thanks I need to know from where your need came. I usually just bake in conventional ovens with specified times and tempera

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber

According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c

Immersion Silver PCB Surface Plating

Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren

We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the

Moisture sensitive Devices

Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan

I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use

Re: stencil epoxy debonding

Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber

There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det

Re: Solder paste recovery

Electronics Forum | Tue Nov 28 18:10:13 EST 2000 | Michael Parker

Norman- I would be pushing to get the real world to match the ideal world, in other words get your jobsetters to do the right thing. You are looking to incur more costs to justify not having to make people do their job right. A bit of training a

Promote Your Company and Yourself with Papers and Technical Arti

Electronics Forum | Fri Mar 23 10:26:47 EST 2001 | Andre

Your papers and technical articles are in demand for use with the SMT Express. We would like to offer our readers well-written technical articles covering issues crucial to the SMT industry. Your contributions will help you by making your name know


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