Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
Electronics Forum | Tue Oct 11 11:54:36 EDT 2011 | Shean Dalton
There are aerosol spray on flux removers that contain Trichloroethylene. There are also many other flux removers on the market. Recommend you explore more options. To help get an answer quickly, you can contact Zestron, Kyzen, Petroferm, etc; an
Electronics Forum | Fri Jun 01 10:52:37 EDT 2012 | blnorman
Neither the Omega meter nor the IC are officially "destructive" tests, but everywhere I worked we treated them that way. The boards were scrapped after the test. The Omega meter can be tested at elevated temps, but the IC sample is extracted at ele
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Tue Nov 28 18:10:13 EST 2000 | Michael Parker
Norman- I would be pushing to get the real world to match the ideal world, in other words get your jobsetters to do the right thing. You are looking to incur more costs to justify not having to make people do their job right. A bit of training a
Electronics Forum | Tue May 02 14:19:26 EDT 2000 | Bill Schreiber
There are two primary causes of epoxy adhesive bond failure, heat and over exposure to moisture. Ultrasonic cavitation is a only a mechanical "scrubbing" action on a microscopic level. However, if the adhesive bond is week or has small areas of det
Electronics Forum | Fri Mar 23 10:26:47 EST 2001 | Andre
Your papers and technical articles are in demand for use with the SMT Express. We would like to offer our readers well-written technical articles covering issues crucial to the SMT industry. Your contributions will help you by making your name know
Electronics Forum | Tue Feb 08 12:39:52 EST 2000 | Ashok Dhawan
I have three questions on moisture sensitive devices: 1. What is general practice on incoming / receiving inspection of moisture sensitive devices- which boils down to mostly FPDs and BGAs ? Traditionally, FPD packs were opened only at time of use
Electronics Forum | Tue Feb 01 14:21:24 EST 2000 | Dennis VanBuren
We are considering the use of Immersion Silver for a PCB surface finish. We currently use Immersion Gold surface finish, which has served us well. However, recent discussions on the cracking of corner joints on large pin count BGA packages, with the
Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber
According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c
