Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Thu Mar 20 13:22:27 EST 2003 | bmaheu
James, I've done some extensive studies cleaning BGA's while I was employeed by one the companies you are considering. In an attempt to avoid being commercial I will use general statments to address your question(s). The key to cleaning underneath
Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Thu Jan 08 15:03:40 EST 2004 | dwzeek
We have an ongoing problem with our QFP144 packages soldering. It has not received much attention until late due to some customer failures. Most of the failures would show up in ESS testing and be repaired. The failure rate is about 2 in 1000 parts f
Electronics Forum | Thu Mar 03 16:41:11 EST 2005 | davef
According to an on-line posting ... SMTA On-line Presentation Comparing Industry Standard Revisions March 9: IPC-A-610 with Regards to Lead-free Technology There have been extensive and significant changes to the industry standard IPC-A-610 with th
Electronics Forum | Fri Mar 11 18:30:50 EST 2005 | davef
Russ: In December 2003, the European Commission released the following statement: �The commission services have prepared a draft Commission decision establishing maximum concentration values pursuant to Article5(1)(a) of Directive 2002/95/EC. The pr
Electronics Forum | Thu Apr 28 14:07:24 EDT 2005 | bschreiber
Hello Paul, Prior to 1980, I would say that your concerns were real regarding the resonant frequency. However, since then all major ultrasonic cleaner manufacturers use a "sweep" frequency technology. By "sweeping" or alternating the frequency bet
Electronics Forum | Wed Jan 24 07:57:26 EST 2007 | Mark
Like everyone has said make sure you request Cad files from your sales people first. Than if sales allows (which I'm sure they will) is call the customer and go through with them step by step how to extract the cad file that you need. If you refer to
Electronics Forum | Mon Mar 26 06:10:54 EDT 2007 | RH
Dennis: Have you considered Asahi as a solder ball source? Asahi Technologies has helped produce over 90 million Lead Free PWB assemblies worldwide and has extensive experience in Lead Free solder processes at Sony, Hitachi, and Thompson. Solutions
