Electronics Forum: extra components (Page 1 of 25)

extra zeros very confusing....

Electronics Forum | Tue Oct 22 13:28:03 EDT 2002 | slthomas

Brian, Since the change, I have seen numerous instances of extra zeros being added to numeric values, typically those of 3 (original) characters or more. Case in point, a contribution by our friend Mr. Fish that I have cut and pasted: "The steadfa

Removing extra gold bleeding from pads

Electronics Forum | Wed Jan 09 12:53:55 EST 2013 | scais

Hello, We are having issues to solder components. We investigate the issue and found that the pads were having extra gold on the sides. Is it normal? Can we remove this gold 'bleeding from our PCB?' Thanks

Removing extra gold bleeding from pads

Electronics Forum | Wed Jan 09 18:08:23 EST 2013 | hegemon

Not exactly normal, I don't think. Though I have seen similar in the CM world. I can't think of a way to remove that overplating, either. If you can't reject the boards outright, then you might be looking at some touch up work, should bridging hap

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 11:22:43 EST 2001 | denis

We are a contract manufacturer and we do business with a big company. There is a mistake in the design of the PCBs they are supplying: the pads are too long (under the component) and sometimes we get short circuit we cannot see. Changing the design w

Can we hide extra long pad with solder mask ?

Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef

Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of

Baking components at 70 degree

Electronics Forum | Wed Dec 19 22:32:03 EST 2007 | davef

Nerdyboy don't write no blanking program. Get two extra carriers of the same size and configuration as the low temperature carrier that you want bake at a higher temperature. One of the these extra carriers needs to be high temperature material that

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics

Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

Component not at nozzle before placement-0402 components

Electronics Forum | Wed Dec 12 15:00:43 EST 2007 | mefunak

Hi,everybody! There is an interesting things happened with the 0402 components- machine Siemens HF3,it's an Emergency Stop error message " Component not at nozzle before placement" and there is a chance to find an extra components lying in a mess on

lead free components in leaded process

Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963

In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th

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