Electronics Forum | Sun Aug 10 03:41:20 EDT 2008 | eyalg
Thanks for your promt reply It was very usefull Eyal
Electronics Forum | Mon Feb 14 08:41:36 EST 2000 | Graham Naisbitt
Chris, With thanks to Eyal, this is Graham Naisbitt (NiceBit? - Talk to Eyal later!) We can indeed offer you semi-automatic equipment from around $8K US. Your budget is really low, we have to make a living too you know. However, this equipment do
Electronics Forum | Sat Jun 09 06:34:36 EDT 2001 | Eyal Dickerman
Hello Wehave very good results with CyberOptic LSM300 with SPC software (applied..) Eyal
Electronics Forum | Fri Oct 22 11:01:10 EDT 1999 | Eyal Dickerman
SIEMENS introduced recently new feeder made by HOOVER-DEVIS (USA) which will work similar to normal componenet feeder BUT only on SIPLACE machines. Eyal
Electronics Forum | Fri Jan 23 04:24:29 EST 1998 | eyal dickerman
The best handling unit is made by -FRITSCH GmbH- they do have also rep in u.s.a eyal d
Electronics Forum | Sun Aug 10 03:39:21 EDT 2008 | eyalg
Thanks Pete yes we usu ROHS solder paste in our process. I agree that this termination is more suitable for adhsive bonding rather than soldering. We'll try changing the termination type as you recommended. Eyal G
Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Wed Aug 27 07:13:05 EDT 2008 | eyalg
I need to solder SAC/HASL PC boards in a NON ROHS process (Tin Leaded solder paste and profile + Tin leaded components) Can I do that?? Regards, Eyal
Electronics Forum | Mon Dec 27 02:47:14 EST 1999 | Eyal Epstein
We at Celtronix have extensive experience and customers, whom we have supplied Pin in Paste solutions. We can send you a lot of information, including references to our customers. Celtronix is a supplier of odd form automation solutions, including ma
Electronics Forum | Mon Aug 11 07:27:32 EDT 2008 | eyalg
We had experienced two (2) A BGA which fail (detached) off the board. Surprisingly we noticed that most of solder joints remains on the board leaving perfectly exposed and clean pads on the on BGA package (virgin pads) . Note: No mechanical stress wa
winsouce.jpg)
