Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Wed Apr 28 07:35:54 EDT 1999 | Corey Peterson
| | | As I transfer prototypes/pilots out of my shop (because the designs are mature or Engineering confidence is high). How do I minimize my risk and ensure success for both the CEM and my boards. | | | | | | Best Regardsgroup. This would include
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Fri Jun 18 14:19:29 EDT 1999 | Earl Moon
| | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave re
Electronics Forum | Fri Jun 18 17:18:27 EDT 1999 | Jason Gregory
| | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave
Electronics Forum | Fri Jun 18 17:19:48 EDT 1999 | Jason Gregory
| | | | | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rav
Electronics Forum | Wed Dec 09 21:45:11 EST 1998 | Dave F
Graham: I agree. Very thorny. What is clean?? And how is that controlled?? Back 25 or so years ago, soldering was done with high solids rosin fluxes. The issue with cleanliness was ionic contamination. The US military and others set a fairly a
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
Electronics Forum | Fri Jan 15 17:13:07 EST 1999 | Earl Moon
| | | | Hello, | | | | | | | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | | | | | | | So far, the tests I can think of
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