Electronics Forum: fabricators (Page 46 of 85)

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi

SMT Stencil Design

Electronics Forum | Fri Feb 16 03:11:35 EST 2018 | robl

Hi Ameen, Have you tried talking to your local stencil fabricator? they tend to have rule sets built up over years of experience. We are very lucky in the UK to have excellent, very knowledgeable suppliers. Also, stencil design rules are built in

Gerber file format requirement

Electronics Forum | Thu Jul 26 12:04:16 EDT 2018 | wendymm

RS-274X file contains the complete description of a PCB layer image without requiring any external files. It has all the imaging operators needed for a PCB image. Any aperture shape can be defined as well as positive and negative objects. Maybe that

Solder mask vs non solder mask defined pads

Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15

The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif

Work Board Holders for Universal Through Hole Machines

Electronics Forum | Wed Jun 08 19:18:43 EDT 2022 | fuji_user_2014

I'm having some issues with lead time with my current fabricator of work board holders for my Universal THT machines (I won't name names). I've been waiting for a couple of months on some of my orders from them. My machines have a standard rotating t

IPC-6012F 2023 EN,Qualification and Performance Specification for Rigid Printed Boards

Electronics Forum | Wed Jan 03 17:37:16 EST 2024 | davef

IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards Changes address advances in rigid printed board fabrication processes Oct 18, 2023 [https://www.ipc.org/news-release/ipc-releases-ipc-6012f-qualification-and

Re: Tombstoning 0402

Electronics Forum | Tue Dec 26 12:35:09 EST 2000 | Dave F

Your English is fine. Your assessment that corrosion on a portion of the metalization on the end of a component is causing the tombstoning is reasonable. We've seen that before. Corroded components received from a supplier is not acceptable as an

Immersion Silver - Sulphur

Electronics Forum | Sun Feb 23 14:32:42 EST 2003 | davef

Sources of sulphur in PCB fabrication are: * Some locales have high H2S concentrations in the air. * Metal etching steps that use sulfuric acid or a sulfonated buffering compound may result in sulfate residues. * Sulfates can come from contact with

Re: Board contamination

Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F

Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For

Gold coated spring contacts

Electronics Forum | Tue May 29 12:35:36 EDT 2001 | genny

Dave, Sorry to drag this out some more. When I saw this thread I realized that we often get PWB's fabricated with a gold plated edge connector tab. However we have not ever given any specs to the fabricator regarding the gold plating - all we say i


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