Electronics Forum: fabricators (Page 71 of 85)

SMT COMPONENTS

Electronics Forum | Mon Jul 15 15:44:11 EDT 2002 | davef

For us, no. Pain in the butt, yes. Volume build shops do not have the inherent flexibility that quick turn shops have built into their systems to deal with these problems. I�d speculate that this issue will help LARGE contract shops to rethink the

Shrinkage in paper phenolic pcbs

Electronics Forum | Fri Aug 23 10:28:23 EDT 2002 | davef

Ah, CHEAP boards. You pay me now, you pay me later, eh? The buyers get BIG bonuses. The production types get trashed, 'cause they can run aboard they've been doing for years. Wassup? For a specification, look to: * IPC-6011 - Generic Performance

PCB's for oven profile testing

Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef

Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s

SMT

Electronics Forum | Tue Aug 27 22:07:45 EDT 2002 | davef

Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed circuit board. Mask. A material applied to allow selective etching, plating, or protection of the surface of a printed circuit board.

Where do I Start?

Electronics Forum | Fri Sep 06 11:29:03 EDT 2002 | genny

We are a company that designs a product but gets the PCB fabricated and the surface mount assembly done out of house. The product then comes in house and we test it, do some final assembly on it, and ship it. We recently had a prototype run of PCB'

baking boards, revisited

Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef

We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes

Insufficient Wetting to Lands

Electronics Forum | Sun Nov 24 09:54:24 EST 2002 | davef

On a HASL board that has poor wetting on the pad, consider looking further downstream in the process than your assembly shop. For instance, take a look at the bare boards. Look for solder mask bleed onto the pads. This will show-up on the outside

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman

Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension

Accidental solder mask

Electronics Forum | Tue Dec 17 16:27:02 EST 2002 | davef

I�m not clear on the problem. What I get: * Your fabricator did not deliver the product that you asked for in your purchase order. * Pad. Land. A portion of a conductive pattern used as a termination area. Metal surrounding a hole on a printed ci

Black pad defect

Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef

What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship


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