Electronics Forum | Wed Apr 18 04:22:43 EDT 2007 | ray
I facing dewetting problem on Ag/Pd termination(chip component)during reflow process. The solder wetting is pull to terminal side and exhibits dewetting. Any one ever face the same problem and any solutions for the problem?
Electronics Forum | Mon Nov 02 11:16:23 EST 2015 | capse
I'd look close to home first. Nothing beats meeting face to face with the EMS guys. You may sacrifice lowest price but gain a better overall experience.
Electronics Forum | Tue Jan 15 14:11:12 EST 2019 | griinder
I also use these when available. The problem still persists for Bottom Paste/Parts layer. The non-symmetric(x axis) footprints in the Btm part layer, display correctly in the software, But then display incorrectly when imported into the Printer. The