Electronics Forum: facing (Page 1 of 67)

facing cold joint problem

Electronics Forum | Sun Jan 18 09:38:34 EST 2004 | m_imtiaz

we are facing cold joint problem in selected component please advise me possiblity of this problem imtiaz

facing cold joint problem

Electronics Forum | Sun Jan 18 10:13:59 EST 2004 | davef

Materials added to solder can change its appearance. For instance: * Gold in tin/lead solder is dull / grainy * Palladium in tin/lead solder is dull / grainy We do NOT advocate using visual appearance to define the appearance of a good and a bad so

facing cold joint problem

Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf

How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t

Anyone facing QFN package crack problem ?

Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs

Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.

Anyone facing QFN package crack problem ?

Electronics Forum | Sun Dec 02 20:02:23 EST 2007 | chs

Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as compared to 2 sided package, QFN are easily damaged by external mechanical / thermal force. Phenomenon observed are mold cap open which further caused wire

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 20:03:36 EST 2007 | chs

Hi, Thanks for the info. You mentioned about TQFP, how about QFN, which is leadless and one sided package compared to TQFP ? Actually, we are component manufacturer. Recently we have multiple customer come back with issue of electrical failure on par

Anyone facing QFN package crack problem ?

Electronics Forum | Fri Nov 30 19:39:51 EST 2007 | mika

Hi chs, What type of QFN or MLF package are we talking about? Assuming there is a middle thermal pad? Body Size & no. of terminals & pitch? What about your statement: "This package is so sensitive to any external force". Can you please explain what y

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson

I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha

Anyone facing QFN package crack problem ?

Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson

Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,

Forums a bit ugly

Electronics Forum | Sun Sep 24 20:50:47 EDT 2006 | KEN

...another nice feature is editing your own post. I just found a spelling error (dooh) on a post. Smiley faces. We want smiley faces!

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