Electronics Forum | Wed Nov 13 04:36:46 EST 2002 | iman
does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfalls to avoid? The product we have been asked to use
Electronics Forum | Fri Mar 29 10:51:20 EST 2002 | lsmith
The IPC-EM-782 reads as follows: the adjustment factor is usually intended to increase the Z dimension slightly, but brings the Z maximum up to an even equivalent. Example if Zmax is 2.100mm then you would enter an adjustment factor of .100mm. The ad
Electronics Forum | Mon Dec 28 19:07:38 EST 1998 | flag
can some kind of through hole type connector pass through the smt process (with IR technology)???? the temperature factor or material factor?????
Electronics Forum | Thu Sep 27 13:11:07 EDT 2001 | Nankar
what factors should be monitored and controlled during assembly of components on PCBs and their storage? Temperature and humidity seem obvious. Should one also watch out for any particular gases that may cause oxidation? Or dust?
Electronics Forum | Fri Aug 01 00:22:46 EDT 2008 | fowlerchang
Pattern design, paste volume,printing misalignment, place misalignment,reflow process include N2 usage. All the factor above can make tombstome happen. And the most important factor is placement misalignment except design issue. But pls check the sol
Electronics Forum | Thu Jun 14 22:50:45 EDT 2001 | gregH
Hi, I read an article that says "Flux selection usually depends on the following factors": a) Solderability of pcb base metal or coating b) Corrosivity of vapours and residues c) electrical resistivity of residues d) Ease of removal of residues e)
Electronics Forum | Thu Apr 18 17:29:00 EDT 2002 | dason_c
The industrial standard is follow the R.O.S.E test as a guideline per J-STD-001 and the limit is 10ug/sq. inch. Different tester with different equivalent factor with the ROSE and you can refer back to the manual, the Zero Ion tester with equivalent