factors

"factors" search results in the Electronics Forums



946 results found for "factors" in the Electronics Forums

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PCB Design

Dec 22, 2016 | Thanks a lot. This is my first design practice. And i will take other factors into consideration whe

smd capacitors- ICT measuring

Jun 14, 2013 | The low value will be 0.624uF. You have to factor it from the low tolerance (-10%). So: 0.9 x 0

% of wasted components in SMT production

Mar 25, 2010 | We factor in 3% to our older Quad machines.

Design of experiments 2E2 help!

Aug 21, 2009 | thanks davef according with DOE, most significant factor was the placement force applied to compone

Solder paste process

Apr 30, 2009 | One factor I see missing is separation speed (or snap off speed). I've run experiments with differe

PCB Baking after Wash

Dec 4, 2008 |

UV Curing Conveyor

Sep 23, 2008 | Also be sure you know your material, as UV wave length will play a factor in your curing.

solving tombstone

Aug 1, 2008 |

Costings

Apr 24, 2008 | Hi all, Just a quick question on the quotation process. SMD - is there a factor added if the b

Tombstoning issues!!!

Apr 22, 2008 | Many factors will make tombstone happen. from design/stencil aperture/soler paste/placement/reflow a

When to trash the solder paste

Aug 8, 2007 | Thank you! And I agree with you. The temperature is an important factor. I will check our supplier's

When to trash the solder paste

Aug 3, 2007 | Hi Roy, Depends onmany factors. Your plants environment, the ype of paste, the size of the syrin

SMT Component Yield Factors

Jul 10, 2007 | Multiple Factors that account for Scrap: During Set-Up: A percentage will not work. When se

SMT Component Yield Factors

Jul 9, 2007 | Does anyone have any industry standard yield factors to load at the component level to account for s

BGA opens

May 2, 2007 |

Need a new Pick/Place. Recommendations?

Mar 27, 2007 | High mix low volume I would say Mydata would be a good choice, If set up time isn't a big factor I w

Pick & place

Mar 27, 2007 | High mix low volume I would say Mydata would be a good choice, If set up time isn't a big factor I

Feeder Setup?

Mar 20, 2007 | Rule of thumb in contract manufacturing...mark it up! Make it 3 min. + a 25% "fatigue" factor. :

APEX Venue!!

Mar 6, 2007 | No kidding...and if you can guarantee the prostitution rate would increase by a factor of 10% instea

IC short

Jan 19, 2007 |

Criteria for thermocouple wire attachment

Dec 27, 2006 | Hi Jack, I've seen around 7 degrees diff in max temp. The real factor here is time to reach peak

Solderbridges wave soldering

Dec 1, 2006 | orientation is also a factor here, So what is the pitch of these connectors? the lead length? the

Ok gurus got a question?

Nov 30, 2006 | Cycle time is one thing, "operating factor" is another. Set-up and tear-down should be seperate fro

Peak Temperature

Oct 18, 2006 | Hi all, If a component is rated as Peak Temperature 225 DegC. Is there a safety factor built into

i-PULSE placement systems

Sep 22, 2006 |

Imm Silver and Voiding

Jun 22, 2006 |

MyData Placement Accuracy

May 17, 2006 |

Solder Bridging on Nexlev Connector

May 7, 2006 | I am seeing high solder bridging for Nexlev Connector.Can someone advise what are the factors causin

Thermal Profilers

Feb 22, 2006 |

Production Line setup

Feb 21, 2006 | It depends on many factors. What size is your board? How many placements? What mix of placement?

Internal Oven Calibration

Feb 11, 2006 | One factor everyone overlooks is that furnace and external T/C wires are (generally) not calibrated.

Thermal cycling

Nov 4, 2005 | i though they had a accleration factor as a relationship between ATC and actual life cycles

Leadfree Trials

Sep 6, 2005 |

Factors affecting solder quality

May 26, 2005 | Factors that affect the solder joint quality are *envirinmental condition(i.e.,humidity) *contamin

BGA rework rate

Feb 10, 2005 |

Need camera for MPM AP-20

Feb 1, 2005 | We are still interested. Cost is a big factor. Our management and engneers will concider all sources

BGA Soldering

Nov 1, 2004 |

Grainy Solder Joints

Jun 25, 2004 | The potting definitely is a factor in fracturing the grainy joints, but does not seem to damage a "g

Volume of paste deposited with respect to board thickness

Jun 1, 2004 | We agree with John about his comments on the controlable factors relating to your printer, but we'd

mil to mm conversion chart

May 25, 2004 | Use "40" as a down and dirty conversion factor, where: * Multipling X mm by 40 gets Y thou * Divid

Flip chip or wire bond?

May 10, 2004 |

.5mm BGA

Feb 20, 2004 | That will depend on so many factors: solder type / flux type sphericity of balls in paste stenc

QFP Coplanarity & Alloy 42

Sep 30, 2003 | Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor

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Voidless Reflow Soldering

Electronics Equipment Consignment