Electronics Forum | Wed Nov 13 04:36:46 EST 2002 | iman
does anyone know what environment factors(specifications?) and process control parameters(printer & reflow?) are optimal for running SMT using type 4 and type 5 solder paste respectively? Any pitfalls to avoid? The product we have been asked to use
Electronics Forum | Sat Oct 16 03:40:04 EDT 2021 | seamarkxray
This is Joy Rong of Seamark ZM, we would like to introduce you more about the machine. My contact: whatsapp +8618779975930 email: info@seamarkxray.com
Electronics Forum | Sat Oct 23 07:53:38 EDT 2021 | smtconnie
what product do you need to inspect?
Electronics Forum | Sun Oct 17 20:00:48 EDT 2021 | ttheis
We have a YesTech AOI which we have been pleased with. I understand they also make xray inspection systems (perhaps hybrid too) so I would recommend talking with YesTech.
Electronics Forum | Thu Oct 14 14:11:33 EDT 2021 | SMTA-64387257
Hi All, We are currently looking to add an Xray inspection system into our process. We build high density assemblies with ultra fine pitch BGAs, 0201's, QFN's and every package type one can think of. We would like to use the inspection system to v
Electronics Forum | Thu Jul 19 23:52:17 EDT 2001 | Victor
Load Factor = Board Length / (Board Length + Space) (you can get the maximum loading factor from the manufacturer, usually ranges from 0.5 to 0.9) Oven Throughput = (Conveyor Speed x Load Factor) / Length per Board
Electronics Forum | Fri Mar 29 10:51:20 EST 2002 | lsmith
The IPC-EM-782 reads as follows: the adjustment factor is usually intended to increase the Z dimension slightly, but brings the Z maximum up to an even equivalent. Example if Zmax is 2.100mm then you would enter an adjustment factor of .100mm. The ad
Electronics Forum | Mon Dec 28 19:07:38 EST 1998 | flag
can some kind of through hole type connector pass through the smt process (with IR technology)???? the temperature factor or material factor?????
Electronics Forum | Thu Sep 27 13:11:07 EDT 2001 | Nankar
what factors should be monitored and controlled during assembly of components on PCBs and their storage? Temperature and humidity seem obvious. Should one also watch out for any particular gases that may cause oxidation? Or dust?
Electronics Forum | Thu May 26 21:13:17 EDT 2005 | thaqalain
Factors that affect the solder joint quality are *envirinmental condition(i.e.,humidity) *contamination *Flux residues *all of the above
