Electronics Forum | Tue Sep 16 08:02:15 EDT 2008 | cyber_wolf
OEE is something that is difficult to project, because there are many factors that effect it. Component replenishment, change-over times, programming issues etc. I am sure the Fuji applications folks would be happy to figure out how many modules you
Electronics Forum | Tue Sep 23 13:00:28 EDT 2008 | mikesewell
I installed an On Site unit for our SS machine. You'll need to size it in terms of flow rate to your equipment (possibly put a reservoir tank in) and decide on what purity level is required. Maintenance was very minimal. Just remember to factor it
Electronics Forum | Fri Jan 02 08:10:18 EST 2009 | childs
Thanks for the reply Stephen. The time factor sounds logical for moisture invasion during cleaning, probably why there's no articles showing concern about the process. I did try experimenting with some samples and believe it or not could not dupli
Electronics Forum | Fri Mar 06 12:38:34 EST 2009 | mgershenson
Is this a manual measurement machine? As already stated, knowing the height of the pad underneath the paste brick is critical to knowing the true height an/or volume of paste. Any decent automated inspection system will have a way to factor out the p
Electronics Forum | Thu Apr 23 21:07:09 EDT 2009 | luismolinero
Emilio: Several factors you need to take into account and your process parameters will depend on: Solder Alloy, Is there any Fine Pitch?; BGA?; Smaller chip size?. Tipically you should go for controls in: Solder Temperature and viscosity; blade and s
Electronics Forum | Fri May 15 08:04:32 EDT 2009 | rwyman
higher temp/shorter time). Solder mask may be a factor as well. I've seen parts get knocked off where the glue is still affixed to the part, along with a nice piece of solder mask from the board. If you can knock a part off with casual contact, th
Electronics Forum | Tue Nov 10 15:01:50 EST 2009 | rgduval
Check out this paper: http://www.xs4all.nl/~tersted/PDF_files/Plexus/tombstoning.pdf You can also search the SMTnet archives for more information. If you're tombstones are random as you describe, likely the problem is not with the profile; but som
Electronics Forum | Fri Feb 19 08:02:38 EST 2010 | duso02
We regularly strip conformal coating for military customers. Connector removal is not required. The type of coating is the biggest factor. Acrylics and silicones are easy and will come off nicely without any other damage. Epoxy and fully cured polyur
Electronics Forum | Thu Apr 08 14:54:39 EDT 2010 | davef
We can make the numbers come-out looking impressive either way. In real life, our sense is: fully burdened, it is a little less expensive to use a contractor. Now, we're only talking costs. Non-cost factors often end-up putting on the brakes and t
Electronics Forum | Tue May 25 11:37:50 EDT 2010 | davef
Where on the assembly is the dewetting occurring? Factors that influence dewetting usually involve non-ionic contamination such as: * Residues from board manufacture including silicone surfactants from solder resist & HASL rinse contamination * Comp
