Electronics Forum | Tue Feb 27 18:10:55 EST 2001 | davef
I�m unclear about � "BB training"??? "BB candidates"? Is BB [Box-??] [Bhote-??] a Design Of Experiments technique like Taguchi? As a start, the following affect the "attrition rate": * Assembly machine program * Machine calibration and maintenan
Electronics Forum | Mon Apr 09 20:13:01 EDT 2001 | davef
First, some people wait a lifetime for ... ;-) Second, how do you guys measure the stencil aperture clog? What do you think of the Magnaplancil from Fendelaz? It�s a double fyv-blue-green CO2 laser refract-defractometer. ;-) Third, do you really
Electronics Forum | Thu Jul 20 12:16:26 EDT 2000 | Dave F
Bob: On "paste push-out" (when inserting a component lead into a through hole pushes the paste out of the hole) in pin & paste assembly: * What factors affect paste push-out? * What techniques reduce this effect, given a board design and component
Electronics Forum | Wed May 16 14:33:36 EDT 2001 | John
The size/type of screw and its preloaded torque are determined by the type and intensity of the load being applied to it. This should be known or estimated by the engineer that designed the product. Then they'll typicly apply a large safety factor
Electronics Forum | Wed Jun 13 17:50:06 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Wed Jun 13 17:50:28 EDT 2001 | deonn
Igmar, Have had similar problems in the past caused by different factors. The first obvious area to check is in your pick and place machine. Too much force in the Z-Direction may cause micro-cracks, which are not apparent, until the board is proces
Electronics Forum | Fri Jun 29 18:43:16 EDT 2001 | procon
Dear Danial, The only stupid thought is the one left only as a thought and not asked. The size of the board and the placement of the BGA on the board could play a big factor during reflow. If you are processing boards on an edge conveyor and the boa
Electronics Forum | Mon Jul 23 13:26:23 EDT 2001 | Hussman
Yes, by the component is a start. There is also board cost, and process material costs, engineering costs if needed, pallet cost if needed, and packaging costs. Inspection and test are another part of the cost. Will you provide your own test-set?
Electronics Forum | Fri Jul 27 13:16:03 EDT 2001 | cjrjmj
I am looking at the Pump application for several bottom side applications we have. They are heavy in through hole radial and dip content. The initial testing of the stencil was very good, but I am concerned with inspection of the glue. We do a sampli
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
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