Electronics Forum | Fri Jun 18 13:30:01 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Tue Jun 15 14:45:11 EDT 1999 | C. Cross
| I am looking for more information about: | | 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; | | 2) There is some influence of doble wave solder machine (temperature, flux, etc) i
Electronics Forum | Tue Jun 08 23:17:47 EDT 1999 | Scott Cook
| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a
Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
Electronics Forum | Wed May 05 13:15:43 EDT 1999 | Boca
| Can anyone pls email me a typical temperature profile for wave soldering process. | | Thank you vey much. | | rdgs... | Typical depends on the processes you're developing. Key factors in my experience are flux type and requirements, component
Electronics Forum | Wed Apr 14 20:39:02 EDT 1999 | Dave F
| I need to cure conformal coat on a 19" x 15" board. The material needs 7 - 10 minutes at 100deg C, but I have limited floorspace so I'm looking for an oven with about 36 inches heated length and 18 or more inch wide belt. The material we are consid
Electronics Forum | Sat Apr 17 11:56:04 EDT 1999 | Graham Naisbitt
Mike First, you MUST make sure the oven used is extracted. The coating will contain TDI. This is not nice. You would be better considering a silicone solventless. Try contacting HumiSeal. They had a material on the TAC line at Nepcon West that lo
Electronics Forum | Mon Mar 15 13:33:46 EST 1999 | Stefan Witte
| Is there anyone know where to get information on PIck & Place equipment Program optimisation ( to improve the speed of component placement for boards). Thank you | Program optimization usually includes set up optimization for the feeder table(s) a
Electronics Forum | Mon Mar 15 09:55:53 EST 1999 | Justin Medernach
| After rmoving a BGA (plastic)to correct unexplained shorts | I installed another BGA using flux only. | Checking on an X Ray machine and found two shorts. | | can anyone give a good explenation ? | | Thanks | | Ron | Ron, It could be a number o
Electronics Forum | Tue Mar 16 03:28:18 EST 1999 | Scott Davies
Al, In general, I would agree with Justin, i.e. contact printing with a 0.007" stencil is great for 0603 - 1206 size components. However, we also place 0.025" pitch QFP components. We use a 0.006" laser cut stencil and I have found through trial an
