Electronics Forum: failed pull test (Page 1 of 59)

lead pull out issue

Electronics Forum | Wed Aug 25 21:25:28 EDT 2004 | davef

First as a nit, your �substrate� is probably NOT copper. It�s probably FR4 fiberglass/epoxy. Substrate. Base Material. A supporting insulating material upon which parts, components, and elements are attached. Second, enough of that, on to your i

QSV1 Plus CAN card failed memory test

Electronics Forum | Tue May 26 23:42:20 EDT 2020 | smiran082

Hello, I am having trouble the QSV-1 PNP machine. On boot it had trouble connecting to the RT computer as it was hung on a message saying something along the lines of, "Establishing connection to RT computer". After several restarts we still could

QSV1 Plus CAN card failed memory test

Electronics Forum | Wed May 27 09:03:24 EDT 2020 | bobpan

The motherboard bios settings are incorrect. For me to help you please email me. My email address is on my website. www.precision-repairs.com Thanks, Bob

Contamination test

Electronics Forum | Sun Jul 29 21:33:30 EDT 2001 | CAL

Your Ionograph and Zero-ion Values are set by you. There is no raw pass of fail criteria only the limits you set up. Ionograph is great for bare board resistivity (salt) test just as a pass fail for incoming inspection but this is all per your facto

BGA Pull test

Electronics Forum | Mon Oct 25 17:50:46 EDT 2004 | Mike

I work for a PCB Manufacture and I am looking for info on BGA Pull test or strenght test. I have a CM that is experiencing bga's with some weak joints. they are telling me that when they do their pull test the joints are breaking at the nickel inste

BGA Pull test

Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.

When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing

Solderability test - OSP

Electronics Forum | Thu Feb 11 15:04:59 EST 2016 | cinthiaap

What is the most appropriate method to solderability test in OSP surface finish PCB? I have used Edge Dip for Surface Features testing, but the results are failed in some features. I haven't also found standards to OSP surface finish. Thank you for n

Reliability test on PCBA

Electronics Forum | Thu Dec 21 04:27:31 EST 2000 | teohbengee

Need help urgently. Anyone can provide me some information or site on reliability test on PCB assembly like solder joint or anything. Some test like ERSA Test, SHMOO Test, Pull Test, Temperature cycle and humidity Test, vibration Test or any related

Reliability test for connectors

Electronics Forum | Thu Feb 18 20:24:37 EST 1999 | Tony

I'm trying to replace the PTH connectors with the SMT connectors in my design, and would like to make sure the SMT connector solder joints are as stong as PTH's. What's the right test to verify that? Is Pull and Shear test is the right choice? Where

BGA SEM test

Electronics Forum | Wed Jul 27 17:01:14 EDT 2005 | Dreamsniper

Issue: At 60'C test PCB Fails. Operator did simulation. Use of Heat Gun to heat up the BGA to 60'C while PCB is powered and running. At 60'C BGA fails. When pressed system is back which means that something becomes open. Sent BGA for SEM and found t

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