Electronics Forum: failure (Page 1 of 156)

Bga failure

Electronics Forum | Mon Oct 02 20:17:38 EDT 2006 | davef

The different coefficient of expansion of materials used in some BGA can cause warping issues. We've talked about this previously on SMTnet. Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=2

Bga failure

Electronics Forum | Tue Sep 26 16:44:18 EDT 2006 | df

All, We have a board that has failed at burn in. There is a 672 BGA on the board. When the test guy presses down on the BGA the board will pass ! What am I looking at here? Board finish is ENIG - could this be black pad / what should I do to diagn

Bga failure

Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ

could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA

Bga failure

Electronics Forum | Mon Oct 02 19:04:53 EDT 2006 | DC

We had a issue on the SBGA and found stress built up at the corner of the SBGA after cool down to room temperature. It is confirmed by the warpage analysis. I expected that the stress caused by the heat spreader and the epoxy to the copper frame. O

Bga failure

Electronics Forum | Tue Sep 26 18:29:15 EDT 2006 | stepheniii

Profile, profile, and profile. If you can sacrifice a board, the best is to drill a small hole into the a ball from the other side of the board and insert a thermocouple there. I'm 99.99% certain you won't be able to sacrifice a board. (who can the

Component failure analysis

Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee

What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold

BGA solder failure rate

Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith

I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.

Wire bond failure

Electronics Forum | Thu Jan 15 15:16:56 EST 2009 | jsherrow

We recently had our customer report a component failure trend of a few percent. Analysis indicates wire bond failure internal to a d-pak caused by what appears to be chlorine contamination. We're running a lead free process with aqueous wash. 700 co

Wire bond failure

Electronics Forum | Thu Jan 15 21:16:18 EST 2009 | davef

Our first impulse would be to blame someone else. We'd send some of the DPAK from inventory to: * Supplier * Outside failure analysis laboratory ... for delidding and analysis

BGA failure after coating

Electronics Forum | Wed Sep 30 14:17:06 EDT 2009 | davef

What does failure analysis of the BGA indicate? Is this: * ESD damage * Open circuits * Shorting What's the problem?

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