Electronics Forum: failure mechanisms (Page 1 of 15)

MELF component/solder failure

Electronics Forum | Tue May 06 14:52:37 EDT 2003 | bremerg

Pictures are now located at http://www.stevezeva.homestead.com/ These components are 2W resistors that only see 1/2W at max. during normal use. I have contacted IRC still wqaiting for a response. The resistors were tested as good. But the circuit

Mydata TP11 UFP hardware initiation failure

Electronics Forum | Wed Jul 26 15:28:11 EDT 2006 | RLM

How does the machine sense that the fan is working/not working? The fan may be operational but the sense mechanism may be at fault.

what are the main diffrences in failure modes for Bga

Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami

Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway

I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 13:16:23 EDT 2012 | rway

Most likely the depaneling is not your issue, but I do concur that there is some mechanical stress occurring somewhere. What about any fixturing for FT/ICT?

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh

I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

Low Voltage Device damage on z18xx ICT

Electronics Forum | Wed Nov 26 07:45:24 EST 2008 | davef

Investigation of Device Damage Due to Electrical Testing, R Croughwell & J McNeill, Worcester Polytechnic Institute Abstract: This paper examines the potential failure mechanisms that can damage modern low voltage CMOS devices and their relationship

Conformal Coat peeling

Electronics Forum | Sun Apr 05 12:30:22 EDT 2009 | qualityguy

Forum: Has anyone experience conformal coat peeling after HASS and the failure mechanism being low surface energy attributed to the solder mask?

Re: Poor solderability

Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean

Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc

  1 2 3 4 5 6 7 8 9 10 Next

failure mechanisms searches for Companies, Equipment, Machines, Suppliers & Information

2022 Eptac IPC Certification Training Schedule

High Precision Fluid Dispensers
Sell Used SMT & Test Equipment

High Resolution Fast Speed Industrial Cameras.
Voidless Reflow Soldering

High Speed Precision In-Line SPI System - Mirtec MS-11
Dual Lane Reflow Oven

World Source Equipment: Used equipment sale. Hundreds of items on sale.
Software for SMT

Benchtop Fluid Dispenser
PCB separator

Private label coffee for your company - your logo & message on each bag!