Electronics Forum: failure mode (Page 1 of 9)

Component failure analysis

Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee

What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold

what are the main diffrences in failure modes for Bga

Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami

Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture

Dek 265 GSX motor comms failure ...

Electronics Forum | Thu Mar 22 10:11:47 EDT 2012 | menatech

if you download the mint program (maintance key switched and download via auto mode. Does is read the card correct and does it identifies the correct motor encoder?

what are the main diffrences in failure modes for Bga

Electronics Forum | Thu Jul 10 22:44:54 EDT 2008 | davef

Too complicated to answer. Wudda you say that you post pix and we'll tell you what we think?

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh

I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing

fmea

Electronics Forum | Fri May 21 12:13:11 EDT 2010 | davef

Failure Modes and Effects Analysis (FMEA): http://en.wikipedia.org/wiki/Failure_mode_and_effects_analysis

Solder joint crack

Electronics Forum | Tue Jun 25 09:45:39 EDT 2019 | edhare

See also ... https://www.semlab.com/solder-joint-failure-modes/

Failure Mode Effects Analysis (FMEA)

Electronics Forum | Fri Apr 19 15:49:56 EDT 2002 | davef

While our group is not involved in product FMEA, periodically we get dragged, kicking and screaming, into a FMEA for: * Quoting the assembly or test of products. * Evaluating the potential purchase of process equipment. * Assessing the potential impa

Soldering Strength of 0603 Component

Electronics Forum | Mon Oct 04 07:48:34 EDT 2010 | scottp

When you break them where is the failure? Is it the solder joint (doubtful), the part termination, the body of the part, or the board? If in the solder joint, is it in the bulk solder or intermetallic? If in the part, what direction is the crack?

Fillet Lifting

Electronics Forum | Thu Jun 29 13:18:23 EDT 2000 | Gary

I was reading SMTs report on Lead Free solders and saw repeated references to Fillet Lifting as a failure mode. I have not found an explanation of what this is. Can anyone enlighten me? Thanks

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