Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami
Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture
Electronics Forum | Thu Jul 10 22:44:54 EDT 2008 | davef
Too complicated to answer. Wudda you say that you post pix and we'll tell you what we think?
Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh
I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing
Electronics Forum | Fri Apr 19 15:49:56 EDT 2002 | davef
While our group is not involved in product FMEA, periodically we get dragged, kicking and screaming, into a FMEA for: * Quoting the assembly or test of products. * Evaluating the potential purchase of process equipment. * Assessing the potential impa
Electronics Forum | Mon Oct 04 07:48:34 EDT 2010 | scottp
When you break them where is the failure? Is it the solder joint (doubtful), the part termination, the body of the part, or the board? If in the solder joint, is it in the bulk solder or intermetallic? If in the part, what direction is the crack?