Electronics Forum | Mon Sep 20 10:17:19 EDT 1999 | Jeanjean
Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I wonder if it
Electronics Forum | Mon Sep 20 11:50:26 EDT 1999 | Wolfgang Busko
Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I won
Electronics Forum | Tue Dec 11 09:46:58 EST 2018 | davef
What is the difference of the components that fall and the ones that don't fall?
Electronics Forum | Fri Feb 21 11:46:27 EST 2003 | larryk
Everyone is suspecting the epoxy. I'm just trying to understand why. Ryan stated he was having random chips falling off. If the epoxy or cure was the problem wouldn't he see the majority of the components falling off instead of just random?
Electronics Forum | Tue Feb 11 04:08:51 EST 2020 | majdi4
we have a problem : The connector is falling down in the second reflow. This connector is mounted in the first side. You can find attached the reflow profil we work with and a photo of the connector. We tryed with under_film but the connector is sti
Electronics Forum | Mon Jun 14 15:29:49 EDT 1999 | Sergio Luiz Vito
I am looking for more information about: 1) What kind of evaluation can I do to measure the resistance to fall off of a bottom side glueded SMT component?; 2) There is some influence of doble wave solder machine (temperature, flux, etc) in SMDs fal
Electronics Forum | Tue Oct 17 17:27:08 EDT 2006 | adlsmt
Define "pretty easily". Did anyone ever do whatever is making them fall off now before? In most casses where a component "falls off" then someone implements a totally subjective test to make sure the rest of the parts wont "fall off" they damage a lo
Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment