Electronics Forum: fall and down (Page 1 of 40)

Laying down and holding large components

Electronics Forum | Thu May 22 13:31:52 EDT 2003 | Dave

If you have a component with a height issue and want to lay is down (capacitor in this case), what are the best methods to consider? RTV, epoxy or something else?

Laying down and holding large components

Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ

I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may

Laying down and holding large components

Electronics Forum | Thu May 22 14:16:40 EDT 2003 | MikeF

We need more information to give you a good answer. Is this a leaded part (axial or radial) or smt? How big is the part, how much weight per lead? What is the end use environment, will it see any vibration? or temperature extremes? Some general com

Connector is falling down in the second reflow

Electronics Forum | Tue Feb 11 04:08:51 EST 2020 | majdi4

we have a problem : The connector is falling down in the second reflow. This connector is mounted in the first side. You can find attached the reflow profil we work with and a photo of the connector. We tryed with under_film but the connector is sti

Connector is falling down in the second reflow

Electronics Forum | Mon Feb 24 01:40:05 EST 2020 | sarason

Traditionally these connectors are riveted to the board on higher volume telecommunication applications. sarason

Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Thu Oct 21 14:02:32 EDT 1999 | Ron Costa

We are a contract manufacturer currently building a job with IBM CBGA-255 devices and 20mil QFP's that are close to each other. We use a 6 mil laser cut and electro polished stencil with one to one apertures on the BGA's. The customer is experiencing

Re: Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Fri Oct 22 06:19:42 EDT 1999 | TNT

Ron, if I am reading this correctly the 20mil parts are not having problems on a 6mil stencil. If you increase the entire thickness of the stencil to 8mils, there should not be any issues with the 20mil components. The supports you are using could p

Re: Step down stencils using CBGA and 20 mil QFP's

Electronics Forum | Mon Oct 25 15:23:26 EDT 1999 | Dave F

Ron: You're really talking about a step-up stencil in the area of the BGA. I don't think your problem is a lack of solder, but who know? I think you should do some sections on returned boards from your customer to help determine the source of the

Connector is falling down in the second reflow

Electronics Forum | Tue Feb 11 07:35:03 EST 2020 | dontfeedphils

If all else fails, you can always chipbond the part. Would it be possible to run this side as the second reflow?

Connector is falling down in the second reflow

Electronics Forum | Wed Feb 12 07:25:47 EST 2020 | dontfeedphils

If you have control of the solder alloy you're able to use on the product, you could run a lower temp solder on the second side and try to avoid the first side entering reflow.

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