Electronics Forum: fatigue (Page 1 of 10)

Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles

What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Re: Thermal fatigue of solder joints

Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho

HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of

SMD pad definition may cause solder joint cracking under extreme fatigue conditions.

Electronics Forum | Thu Feb 02 10:10:20 EST 2023 | tommy_magyar

Perhaps google this, as you will find very interesting articles. For scientific explanation look up solder fatigue on Wikipedia with references added. A more in depth explanation you can find on the Digikey forum where you will find other people like

SMD pad definition may cause solder joint cracking under extreme fatigue conditions.

Electronics Forum | Thu Feb 02 09:07:28 EST 2023 | charles_nguyen

Two types of land patterns used for surface mount pads are non-solder mask defined or NSMD pads and solder mask defined or SMD pads.Each type has its own advantages and disadvantages. There is a statement that SMD pad type may introduce stress concen

SMD pad definition may cause solder joint cracking under extreme fatigue conditions.

Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef

The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef

Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron

Re: Homologous Point

Electronics Forum | Tue Jun 06 15:01:10 EDT 2000 | Charles Harper

The homologous point is the temperature midway betweeen the melting temperature (of the solder) and absolute zero. Below this point the solders are harder, stronger, and more resistant to fatigue. As solders are exposed to higher temperatures above

Solder Joint Fatigue

Electronics Forum | Mon Aug 27 13:18:07 EDT 2001 | Chris

Anyone have any suggestions on an adhesive to improve solder joint fatigue failure a PLCC component. Thanks, Chris

Feeder Setup?

Electronics Forum | Tue Mar 20 09:37:57 EDT 2007 | ck_the_flip

Rule of thumb in contract manufacturing...mark it up! Make it 3 min. + a 25% "fatigue" factor. :-)

  1 2 3 4 5 6 7 8 9 10 Next

fatigue searches for Companies, Equipment, Machines, Suppliers & Information