Electronics Forum: fatigue (Page 1 of 9)

Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles

What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Re: Thermal fatigue of solder joints

Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho

HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef

Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron

Re: Homologous Point

Electronics Forum | Tue Jun 06 15:01:10 EDT 2000 | Charles Harper

The homologous point is the temperature midway betweeen the melting temperature (of the solder) and absolute zero. Below this point the solders are harder, stronger, and more resistant to fatigue. As solders are exposed to higher temperatures above

Solder Joint Fatigue

Electronics Forum | Mon Aug 27 13:18:07 EDT 2001 | Chris

Anyone have any suggestions on an adhesive to improve solder joint fatigue failure a PLCC component. Thanks, Chris

Feeder Setup?

Electronics Forum | Tue Mar 20 09:37:57 EDT 2007 | ck_the_flip

Rule of thumb in contract manufacturing...mark it up! Make it 3 min. + a 25% "fatigue" factor. :-)

High Power Reliability

Electronics Forum | Wed Aug 15 01:30:56 EDT 2007 | wayne_

To be more specific. I am actually talking about the electrical fatigue whereby a unit is undergo a cyclic electric test. Unlike thermal fatigue, it is all talking about temperature related testing, eg, ageing test, thermal cycle test, etc. Anyone of

low thermal emf solder & paste - SAC 405

Electronics Forum | Mon May 12 15:08:53 EDT 2014 | davef

I've never used SAC405. Not for nothing ... Other low temperature solder alloys that you should consider are: * Sn42/Bi58 [138*C]: Alloy for low temperature applications. Attention should be paid to potential embrittlement issues and poor thermal fa

Solder Joint Fatigue

Electronics Forum | Mon Aug 27 15:03:40 EDT 2001 | davef

Essentially, you want to ruggedize this component. Various adhesives could work great, depending on the source of the energy that is causing the solder connection fatigue. So, what are your looking to: * Rigidly bond the component to the board? * A

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