Electronics Forum: february (Page 1 of 5)

Re: Solderability of fired-silver/platinum/palladium lead terminations

Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders

Yes, norm it is. Look back to February 98 discussion on this issue.


Electronics Forum | Tue Nov 20 21:07:42 EST 2001 | davef

You're correct. There�s a review of this book in the SMTnet Newsletter. Maybe last February???

Black pad defect

Electronics Forum | Wed Feb 12 09:42:46 EST 2003 | genny

The issue is on the web. The current issue is February, so check for past issues at http://www.circuitsassembly.com/


Electronics Forum | Thu Jun 06 07:13:54 EDT 2002 | Mr.T

Hi, Does anyone know about if there is any specs of Lead free Joint Strenght by IPC or from Japan? We are Starting a evaluation shortly and should be lead free by February 2003 Regards, Mr.T

Who knows COB ?

Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)

MS2 molten solder surfactant

Electronics Forum | Thu Jan 19 14:15:48 EST 2006 | sarar

Me again - I actually just talked with one of the guys over at P Kay and Dan Feinberg of P Kay will be presenting a technical session on MS2 at APEX this year on February 9th. Just FYI! Sara Rice Foresite Inc. www.residues.com

Toyota sticking pedals recall is a smokescreen

Electronics Forum | Thu Feb 18 15:04:35 EST 2010 | davef

Growing tin and other dangerous whiskers: http://www.electroiq.com/index/display/smt-article-display.articles.smt.surface-mount_technology.soldering.solder-and_flux.2010.february-2010.growing-tin_and_other.html

QFN Rework

Electronics Forum | Wed Feb 24 08:31:52 EST 2010 | davef

Start with the SMTnet Express Newsletter [blue bar on the left side of this page] February 18, 2010 written by our old friend Bob Wettermann

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef

Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron

Programming feeder Setup

Electronics Forum | Tue Nov 23 16:38:12 EST 2004 | rodionp

I will let you use our software for free before it goes retail (planned for january - february 2005), if pricing is a concern for you. We do feeder setup optimization as well as assembly sequence optimization (however we don't do line balancing).

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