Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders
Yes, norm it is. Look back to February 98 discussion on this issue.
Electronics Forum | Thu Jan 19 14:15:48 EST 2006 | sarar
Me again - I actually just talked with one of the guys over at P Kay and Dan Feinberg of P Kay will be presenting a technical session on MS2 at APEX this year on February 9th. Just FYI! Sara Rice Foresite Inc. www.residues.com
Electronics Forum | Thu Feb 18 15:04:35 EST 2010 | davef
Growing tin and other dangerous whiskers: http://www.electroiq.com/index/display/smt-article-display.articles.smt.surface-mount_technology.soldering.solder-and_flux.2010.february-2010.growing-tin_and_other.html
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Tue Nov 23 16:38:12 EST 2004 | rodionp
I will let you use our software for free before it goes retail (planned for january - february 2005), if pricing is a concern for you. We do feeder setup optimization as well as assembly sequence optimization (however we don't do line balancing).