Electronics Forum: ferrite and cracking (Page 1 of 6)

Ferrite Core cracks

Electronics Forum | Fri Apr 02 19:47:45 EDT 2021 | smith88


Ferrite Core cracks

Electronics Forum | Thu Apr 01 20:07:06 EDT 2021 | smith88

Is there a standard that gives criteria for cracks in Ferrite Cores? I have reviewed Jstd-oo1 G and IPC 610 G and do not see a specific reference to Ferrites. Thanks for your help

Ferrite Core cracks

Electronics Forum | Fri Apr 02 18:47:25 EDT 2021 | davef

IEC 63093-1:2020 - Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 1: General specification

BGA and Gold Boards

Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike

Dye and Pry

Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq

All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean

Dye and Pry

Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq

Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the

Re: Silver Epoxy and CEM3

Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson

| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

V-scoring design and equipment questions

Electronics Forum | Mon Jun 12 17:32:17 EDT 2006 | flipit

Hi, A little off subject but I just finished a quick little experiment where I placed 0201 to 1206 and some ceramic resonators at specific distances off the scored edge. The distances from scored edge ranged from 0.025" on up at 0.025" increments.

Pick and Place drops nozzles

Electronics Forum | Wed Jul 27 12:50:59 EDT 2005 | mnguyen

You may want to look at which spindle that is dropping the nozzle and check the O-ring on the spindle head. It's probably bad, cracked, or broken. Replace it and that will fix it

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