Electronics Forum: filled (Page 1 of 98)

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 07:38:48 EDT 2004 | Paddy

Hello, I am wondering if anybody has process experiance of designs which use the above. I understand that the filled via is an excellent thermal cnductor, which is great from a design point of view, but how do these solder through the reflow ovens

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 12:44:54 EST 2005 | ppwlee

Dave, Do you know if such thermal transfer study with CB-100 (or equivalent) is available for review? My customer is pursuing this option and I am curious on how much improvement I would see by specifying a conductive via fill on the board. Rgds, P

Conductive filled Vias on BGA

Electronics Forum | Wed Nov 30 22:25:03 EST 2005 | davef

The authors of this article might get you started http://www.protoengineering.com/documents/viaplug.pdf Other information is: * http://www.dupont.com/pcm/techinfo/general/general9.html *

Conductive filled Vias on BGA

Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef

First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled

High Freq. RF grade ceramic filled PTFE PCB material

Electronics Forum | Thu May 24 07:09:04 EDT 2007 | aj

Any advice with using this type of PCB material would be welcome. aj...

High Freq. RF grade ceramic filled PTFE PCB material

Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef

Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff

Reliability of filled vs open vias, where is the old IBM study?

Electronics Forum | Thu Jun 15 16:28:48 EDT 2017 | davef

You should be searching on RN Wild, not Roger Wild This might be a good starting point https://supplychain.gsfc.nasa.gov/docs/sc2011j.planteb.pacquetteasof1020.pdf

Reliability of filled vs open vias, where is the old IBM study?

Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman

I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.

wave soldering two times

Electronics Forum | Sat Aug 04 07:44:25 EDT 2007 | davef

Thermal cycle* * Requirements for and troubleshooting of poor barrel fill => Hole fill

Improving PTH fill using select solder

Electronics Forum | Wed Dec 19 09:24:21 EST 2012 | swag

Many times we manually add flux from the top side for good fill.

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