Electronics Forum | Wed Feb 02 09:58:00 EST 2000 | Dave
Ashok, I don't understand what they're saying about the gray joint. Usually a gray joint has to do with too much heat. Also, the higher the temperature the lower the fillet because of the increased viscosity of the solder. Correct? Wouldn't yo
Electronics Forum | Wed Dec 15 10:47:57 EST 1999 | Christopher Lampron
I agree with Wolfgang. We are currently reducing appertures by approx. 10% even on the chip components. This still gives us an adequate fillet volume and very greatly reduces the probability of solder balling/beading. We generally refer to the manufa
Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F
snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
Electronics Forum | Tue Sep 15 10:19:23 EDT 1998 | dave c
| Dave, | How thick are your PCBs? Do you have adequate topside preheat or are the bottom preheaters turned up to ensure proper filleting on the top side? | Rob Rob, The average PCB is .062". There is no topside preheaters on our machine
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Wed Mar 20 11:36:50 EST 2002 | slthomas
Are you saying L x W x H didn't answer his question? Unless he wants to know how you're verifying that the post reflow fillet is adequate (which is determined by his pad size as well as your print process and the % metal of your paste), I don't get
Electronics Forum | Sun Apr 21 09:52:07 EDT 2002 | pjc
Francis, The problem with shorter solder lands is you may have a problem getting good heal fillets. In the flash products I built the PCBA was inserted into a plastic shell and then we did an epoxy encapsulation using a Camalot machine. Toshiba, Sams
Electronics Forum | Sat Sep 21 23:38:06 EDT 2002 | ivanchu
I got one problem from my production line recently. One 0.5mm pitch QFP IC have been used on my PCBA. Actually, the defect was happened in randomly. Sometime, we got the fillet completely but sometime is not. The solder joint look like is good, but t
Electronics Forum | Fri Oct 04 12:02:53 EDT 2002 | mzaboogie
Hi Barry, One consideration that you may want to consider is the lead to hole ratio. The higher the ratio, the less solder is required to fill in the gaps and give you a fillet. Heat is a concern. You will need to ensure components will take the he