Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy
Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref
Electronics Forum | Wed Dec 19 15:43:23 EST 2007 | cdsullivan
Hi, I was just wondering what the most common process is for silkscreen/legend removal and/or rework? Scenario: Fab house had a registration issue on some SOT-323 packages where the silkscreen encroached or was actually printed on the surface pads
Electronics Forum | Fri Mar 14 15:14:31 EDT 2008 | samir
Dean, thanks for schooling me on this. I talked to an industry collegue whom I met at APEX, and it was he who had told me of the IAg "rework issue." Basically, he told me that they had field failures on QFPs that were a direct result of trying to "
Electronics Forum | Thu Sep 11 11:45:33 EDT 2008 | swag
Never did find a fool proof solution. Solderability seemed O.K. (at least using the methods we have available in house). Tinned parts and placed by hand and saw little improvement. Pad design is slightly different than recommended but likely not i
Electronics Forum | Fri Oct 02 11:23:08 EDT 2009 | floydf
Does anyone out there have experience soldering > with Pb solder (Sn 63 or Sn 62) to SAC 305 coated > PCB lands (about 50um) or Sn-Cu plated lands > (about 10um). I know soldering Pb free (Sac based > soler) to Pb/Sn coated lands is a no-no, but
Electronics Forum | Mon Mar 08 05:03:24 EST 2010 | grahamcooper22
Hi, I fully agree with isd.jww. The difference in the solder joint appearance of the 2 joints highlighted could be down to a few reasons...reflow profile (I know you've checked, but have you stuck a thermocouple on this actual joint ? ), contaminatio
Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22
Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow
Electronics Forum | Thu Sep 30 16:28:51 EDT 2010 | 18424
Hello All, looking for some help from you guru's. I have several Enig boards with solderability problems. Components ranging from 0402's to ssop's. Using AIM W/S leaded solder paste, profile is beautiful and has been for years running the same produc
