Electronics Forum: final (Page 1 of 107)

Silica gel in final packing

Electronics Forum | Wed Jul 02 06:56:34 EDT 2003 | davef

There's nothing wrong doing about adding a dessicant. You'll need to: * Seal the bag. [you may end-up needing a moisture barrier bag] * Select a dessicant packaging that is ESD dissipative.

Silica gel in final packing

Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef

If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y

Silica gel in final packing

Electronics Forum | Tue Jul 01 21:06:12 EDT 2003 | ramanandkini

My customer just assembles it to the car. We want to use the silica gel to avoid moisture since the assembled part (clock) reach him via ship after 50 days. The electronic circuit board has no conformal coatings at present. We are working on that. Ou

Silica gel in final packing

Electronics Forum | Sat Jun 28 22:52:34 EDT 2003 | ramanandkini

We have an Electromechanical assembly (clock) that has a step motor on the board. This electromechanical assembly is assembled in a screw less plastic moulded casing. The plastic casing is neither air tight nor water proof. The board is with SMOBC+ H

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Sun Mar 04 07:48:50 EST 2012 | dilogic

Are you sure that the parts are bouncing? We had similar problem where diodes were placed very closely and occasionally nozzle pushed already placed part away (due to pick-up tolerance)...

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Mon Mar 05 17:54:07 EST 2012 | swag

Three ideas for you: 1) Make sure nozzle tips are clean. 2) Check coplanarity of leads to bottom of body. If leads are above body, it could be the are not contacting paste well. 3) Investigate static charge in the parts caused by the feeder or

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22

Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Sun Mar 04 09:53:00 EST 2012 | eadthem

What i have on the original 2 problem boards is the parts next to it are SOIC8 and placed using a 125F(.125" dia) 1 of witch is close and we have to Z zone it to place the SOIC last, the others have more than .02" clearance on all sides. The other

SOD323 and SC90 bounceing parts in final PNP stages.

Electronics Forum | Sun Mar 04 01:56:37 EST 2012 | eadthem

What we have had recently is a lot of larger thin (32 thou) thickness boards that have had issues with SC90 diodes bouncing off the pads in the final PNP machine. Our setup, universal instruments GC120 or quad beam 30 spindle lightning heads. This m

What methods do you use for final packaging? Bubble Wrap, bags, trays? Anything unique?

Electronics Forum | Wed Dec 10 11:42:49 EST 2014 | arifa_anees

www.apexpackagingcorp.com/manufactures.html www.abcokovex.com/bubble-wrap.html www.murray-packaging.co.uk/mobile/packaging.html‎Cached www.murray-packaging.co.uk/mobile/packaging.html‎Cached please check the above mentioned links for your query. re

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