Electronics Forum: find (Page 446 of 598)

Rheometric pump head on MPM HiE

Electronics Forum | Fri May 23 04:25:14 EDT 2008 | muarty

One thing that has to be considered when using rheometric pumps is that the board support should match as that of the pump head being used. You can print 6" boards, but you should really still use board supports upto 16". As mentioned previously if t

White residues

Electronics Forum | Sun May 25 10:30:31 EDT 2008 | necdetozyonum

Dear All, I would like to take your opinion about the result that we have faced after cleaning the PC assemblies in a cleaning machine (Miele Dishwasher) with the cleaning detergent Qualitek Everkleen 1005. We use DI water for cleaning purpose in t

CP6-4000 nozzle centering errors?

Electronics Forum | Thu May 29 14:57:26 EDT 2008 | rodrigo

Hi all, Is it normal for some of the small nozzles to be rejected by the wide view camera? Every time I do a nozzle centering the narrow view camera shows green circles for nozzles 1,2,3,4. The larger ones (5 and 6) show the asterisk. The wide view c

Need SMT Tech

Electronics Forum | Wed Jun 18 12:56:31 EDT 2008 | ampearl

I need to find a qualified candidate to join a communications company in the SMT department. The project calls for an individual who has worked with product development building prototypes and testing them in an R&D environment, as well as workin

Criteria for Min Thickness regarding Large and Small pads

Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef

It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu

Rollback the Lead-Free Initiative by Dr. Howard Johnson

Electronics Forum | Tue Jul 08 12:04:31 EDT 2008 | patrickbruneel

Military is outside the scope of the directive. The RoHS directive is mainly focused on electronic equipment with a high potential to end up in the normal waste stream such as consumer products. The EU commission also knows that removing lead from a

QFN void issue

Electronics Forum | Fri Jun 20 18:32:55 EDT 2008 | hegemon

Back when I used to do a lot of these style devices we ran into the same problem you are describing. Use a pattern for the center pad area and keep the total coverage to about 68% of the pad area. Diagonal Stripes, tic tac toe, cloverleaf, dot array

5SN/1.5AG/93.5PB

Electronics Forum | Thu Jun 26 14:25:19 EDT 2008 | jax

Current Acceptable HMP Soldering Methods: 1. Wave / Selective Solder: Some Brands require upgrades to heating elements and Pot materials 2. Laser: Works well with PTH and medium/large passive SMT. Damage to PCB masking can occur when try

OT: Wavesolder Process Engineer Needed

Electronics Forum | Thu Jul 10 15:38:36 EDT 2008 | ck_the_flip

Amen to that Patrick. I am from a traditional Engineering background myself - they never taught wave solder in school. My curriculum was mostly theory and labs. When I got out, I read all the soldering books available at the time and also watched s

Process Costing

Electronics Forum | Thu Jul 03 08:50:15 EDT 2008 | rgduval

We include it as a part of overhead in our costing. However, I'm working to change that....we're a fairly small job-shop, and we run some jobs where we find that final inspection takes as long as the job took to build in the first place. In these i


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